S M Asaduzzaman is a third-year PhD student at Michigan State University. His research primarily focuses on the intriguing realm of Microwave plasma-assisted CVD (MPACVD) Diamond deposition and the refinement of Chemical Mechanical Polishing (CMP) techniques for diamond substrates, with a strong emphasis on achieving superior surface planarization and smoothness. He possesses a wealth of hands-on experience with cutting-edge microfabrication and characterization tools, being well-versed in Scanning Electron Microscopy (SEM), Optical Microscopy (OM), Atomic Force Microscopy (AFM), and an optical profilometer. These tools are integral to his in-depth analysis and comprehension of diamond semiconductors. His research, centered on enhancing the properties of diamond for various applications, holds the potential to revolutionize the fields of materials science and semiconductor engineering.

Joseph Dill is a 3rd year PhD student at Cornell University, advised by Profs. Huili (Grace) Xing and Debdeep Jena. . He completed his BS in physics at the University of Minnesota in 2021. His work at Cornell has primarily focused on measuring the low- and high-field transport of holes in GaN/AlN two-dimensional hole gases.

Prof. Fu received the PhD degree in Electrical Engineering from Arizona State University (ASU) in 2019, and the BS degree in Materials Physics from Wuhan University, China in 2014. Prior to joining ASU, he was an Assistant Professor in the Department of Electrical and Computer Engineering at Iowa State University. Prof. Fu’s research focuses on third-generation wide/ultrawide bandgap semiconductor materials and devices for applications in electronics and photonics. He won the 2021 ISU Regents Innovation Fund Award, the 2019 Palais Outstanding Doctoral Award (the highest honor for ASU ECEE PhD graduates) and the 2018 ASU Outstanding Research Award. His work has been chronicled in over 160 journal and conference publications, 4 book chapters, and 11 patents. His research has been featured by many media outlets including IEEE Spectrum, Semiconductor Today, Compound Semiconductor, Silicon Valley Microelectronics